High-Density Computing Power
High Reliability and Security
Efficient Energy Saving
Intelligent O&M
Main application scenarios:
HPC
High-density virtualization
OA
Main application scenarios
HPC
High-density virtualization
OA
High-Density Computing Power
2 x 350 W CPUs and 32 x DDR5 DIMMs in 1U space
Faster Connectivity for Faster Applications
PCIe 5.0 and 400 Gbit/s NIC interconnection
High-Speed Flash, Doubling the Performance
32 x E1.S or 20 x E3.S SSDs with higher density in the smaller size
50% Better Heat Dissipation Capability Than a Single Heat Sink
Heat pipe remote heat dissipation technology ensures reliable heat dissipation and stronger temperature adaptation
66% Less System Downtime
Unique AI memory fault self-healing ensures stable system running
Saving Energy by up to 8% Compared with the Industry Average
The unique algorithm is provided for the lowest power consumption of fans and CPUs
Industry-leading Power Supply Technology for Higher Efficiency
Three core technologies improve power and efficiency, enabling the industry-leading power conversion rate and the power loss 12.5% lower than the industry average
Intelligent Service Awareness, Dynamic Load Adjustment
The CPU working frequency is dynamically adjusted based on the actual service load
Intelligent O&M
1U rack server
1 or 2 x 4th Gen Intel® Xeon® Scalable processors (Sapphire Rapids) with TDP up to 350 W per processor
Emmitsburg PCH
32 x DDR5 DIMMs, with up to 4800 MT/s speed
Supports hot-swappable drives in the following configurations:
• 10 x 2.5ʺ drives (6–10 NVMe SSDs and 0–4 SAS/SATA drives, with a total number of 10 or less)
• 10 x 2.5ʺ SAS/SATA drives/SSDs (2–4 NVMe SSDs and 6–8 SAS/SATA drives, with a total number of 10 or less)
• 10 x 2.5ʺ SAS/SATA drives/SSDs
• 8 x 2.5ʺ SAS/SATA drives/SSDs
• 4 x 3.5ʺ SAS/SATA drives/SSDs
• 32 x E1.S SSDs
• 20 x E3.S SSDs*
• 2 x M.2 SSDs
RAID 0, 1, 10, 1E, 5, 50, 6, or 60; optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration
Provides expansion capability of multiple types of networks
Supports OCP 3.0 NICs. The two FlexIO card slots support two OCP 3.0 NICs, which can be configured as required. Hot swap and PCIe 5.0 are supported
Provides 5 x PCIe slots, including 2 x FlexIO slots dedicated for OCP 3.0 NICs and 3 x PCIe slots, and 2 slots support PCIe 5.0
Provides 8 x hot-swappable counter-rotating fan modules in N+1 redundancy
2 x hot-swappable PSUs in 1+1 redundancy mode. Supported options include:
• 900 W AC Platinum/Titanium PSUs (input: 100 V to 240 V AC, or 192 V to 288 V DC)
• 1500 W AC Platinum PSUs
• 1000 W (input: 100 V to 127 V AC)
• 1500 W (input: 200 V to 240 V AC, or 192 V to 288 V DC)
• 1500 W 380 V HVDC PSUs (input: 260 V to 400 V DC)
• 1200 W –48 V to –60 V DC PSUs (input: –38.4 V to –72 V DC)
• 2000 W AC Platinum PSUs
• 1800 W (input: 200 V to 220 V AC or 192 V to 200 V DC)
• 2000 W (input: 220 V to 240 V AC, or 200 V to 288 V DC)
The iBMC chip integrates one dedicated management GE network port, providing comprehensive management features such as fault diagnosis, automatic O&M, and hardware security hardening
• The iBMC supports standard interfaces such as Redfish, SNMP, and IPMI 2.0; provides a remote management user interface based on HTML5/VNC KVM; supports out-of-band management functions such as monitoring, diagnosis, configuration, Agentless, and remote control for simplified management
• It is optional to configure the FusionDirector management software that provides advanced management features such as five intelligent technologies and realizes intelligent, automated, visualized, and refined management through the lifecycle
FusionOS, Microsoft Windows Server, SUSE Linux Enterprise Server, VMware ESXi, Red Hat Enterprise Linux, CentOS, Oracle, Ubuntu, Debian, openEuler
Power-on password, administrator password, Trusted Platform Module (TPM) 2.0, security panel, secure boot, and chassis cover opening detection
5ºC to 50ºC (41ºF to 122ºF), compliant with ASHRAE Classes A1, A2, A3, and A4
CE, UL, CCC, FCC, VCCI, and RoHS
L-shaped guide rails, adjustable guide rails, and holding rails
Chassis with 3.5ʺ drives: 43 mm x 447 mm x 798 mm (1.69 in. x 17.60 in. x 31.42 in.)
Chassis with 2.5ʺ drives: 43 mm x 447 mm x 798 mm (1.69 in. x 17.60 in. x 31.42 in.)
*According to the plan, it will be realized within 2023.
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