High-Density Computing Power
High Reliability and Security
Efficient Energy Saving
Intelligent O&M
New-Generation 1U 2-Socket Rack Server
Main application scenarios:
HPC
High-density virtualization
OA
New-Generation 1U 2-Socket Rack Server
Main application scenarios
HPC
High-density virtualization
OA
High-Density Computing Power
High-Density Computing Power
2 x 385 W CPUs and 32 x DDR5 DIMMs in 1U space
Faster Connectivity for Faster Applications
PCIe 5.0 and 400 Gbit/s NIC interconnection
High Reliability and Security
50% Better Heat Dissipation Capability Than a Single Heat Sink
Heat pipe remote heat dissipation technology ensures reliable heat dissipation and stronger temperature adaptation
66% Less System Downtime
Unique AI memory fault self-healing ensures stable system running
Efficient Energy Saving
Saving Energy by up to 8% Compared with the Industry Average
The unique algorithm is provided for the lowest power consumption of fans and CPUs
Industry-leading Power Supply Technology for Higher Efficiency
Three core technologies improve power and efficiency, enabling the industry-leading power conversion rate and the power loss 12.5% lower than the industry average
Intelligent Service Awareness, Dynamic Load Adjustment
The CPU working frequency is dynamically adjusted based on the actual service load
Intelligent O&M
Intelligent O&M
Technical Specifications
1U rack server
1 or 2 x 4th or 5th Gen Intel® Xeon® Scalable processors with TDP up to 385 W per processor
Emmitsburg PCH
32 x DDR5 DIMMs, with up to 5600 MT/s speed
Supports hot-swappable drives in the following configurations:
• 4 x 3.5ʺ SAS/SATA drives/SSDs
• 8-12 x 2.5ʺ SAS/SATA drives/SSDs
• 2 x M.2 SSDs
RAID 0, 1, 10, 1E, 5, 50, 6, or 60; optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration
Provides expansion capability of multiple types of networks
Supports OCP 3.0 NICs. The two FlexIO card slots support two OCP 3.0 NICs, which can be configured as required. Hot swap and PCIe 5.0 are supported
Provides 5 x PCIe slots, including 2 x FlexIO slots dedicated for OCP 3.0 NICs and 3 x PCIe slots, and 1 slots support PCIe 5.0
Provides 8 x hot-swappable counter-rotating fan modules in N+1 redundancy
900 W/1200 W/1500 W/2000 W Platinum/Titanium hot-swappable PSUs in 1+1 redundancy
The iBMC chip integrates one dedicated management GE network port, providing comprehensive management features such as fault diagnosis, automatic O&M, and hardware security hardening
• The iBMC supports standard interfaces such as Redfish, SNMP, and IPMI 2.0; provides a remote management user interface based on HTML5/VNC KVM; supports out-of-band management functions such as monitoring, diagnosis, configuration, Agentless, and remote control for simplified management
• It is optional to configure the FusionDirector management software that provides advanced management features such as five intelligent technologies and realizes intelligent, automated, visualized, and refined management through the lifecycle
FusionOS, Microsoft Windows Server, SUSE Linux Enterprise Server, VMware ESXi, Red Hat Enterprise Linux, CentOS, Oracle, Ubuntu, Debian, openEuler . For more, click here
Power-on password, administrator password, Trusted Platform Module (TPM) 2.0, security bezel, secure boot, and chassis intrusion detection
5ºC to 45ºC (41ºF to 113ºF), compliant with ASHRAE Classes A1, A2, A3, and A4
CE, UL, CCC, FCC, VCCI, and RoHS
L-shaped guide rails, adjustable guide rails, and holding rails
Chassis with 3.5ʺ drives: 43 mm x 447 mm x 798 mm (1.69 in. x 17.60 in. x 31.42 in.)
Chassis with 2.5ʺ drives: 43 mm x 447 mm x 798 mm (1.69 in. x 17.60 in. x 31.42 in.)
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